[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - The high balance symmetric balun for WLAN and WiMAX application using the Integrated Passive Device (IPD) technology
Wu, Sung-Mao, Lin, Wang-Yu, Wang, Kao-Yi, Huang, Chien-Hsiang, Yeh, Wen-KuanYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270803
File:
PDF, 1.24 MB
english, 2009