[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Stress relaxation in plastic molding compounds
Xingjia Huang,, Lee, S.W.R.Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188810
File:
PDF, 333 KB
english, 2002