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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Ball bond characterization: an intensive analysis on ball size and shear test results and applicability to existing standards
Aguila, Ma.M.T., Felipe, R.C., Velarde, A.F., Edpan, J.B.Year:
1997
Language:
english
DOI:
10.1109/eptc.1997.723884
File:
PDF, 555 KB
english, 1997