![](/img/cover-not-exists.png)
[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Event-based use conditions method for thermo-mechanical reliability risk assessment
Sauciuc, Ioan, Goyal, Sanjay, Pei, Min, Harirchian, Tannaz, Tse, Maritza, Kwasnick, Robert, Tripathi, Shantanu, Matusevich, AlenaYear:
2014
Language:
english
DOI:
10.1109/itherm.2014.6892382
File:
PDF, 604 KB
english, 2014