![](/img/cover-not-exists.png)
[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Estimation of thermal constriction resistance for simple thermal network analysis of electronic components
Tomimura, Toshio, Ishizuka, MasaruYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117171
File:
PDF, 1.58 MB
english, 2011