Study of thermal cycling and temperature aging on PbSnAg...

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Dugal, F., Ciappa, M.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.001
Date:
September, 2014
File:
PDF, 1.49 MB
english, 2014
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