Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules
Dugal, F., Ciappa, M.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.001
Date:
September, 2014
File:
PDF, 1.49 MB
english, 2014