[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Thermal simulation and power map modeling sensitivity study for chipset silicon
Eng Kwong Lee,, Dhinesh Sasidaran,, Wai Keong Cheang,, Song Chin Deo,, Kiat Hong Ng,, Chee Siong Lee,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510282
File:
PDF, 8.17 MB
english, 2007