[IEEE 2011 IEEE Electrical Design of Advanced Packaging and...

  • Main
  • [IEEE 2011 IEEE Electrical Design of...

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Impedance of power distribution networks in TSV-based 3D-ICs

Kiyeong Kim,, Jun So Pak,, Heegon Kim,, Junho Lee,, Kunwoo Park,, Joungho Kim,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/edaps.2011.6213800
File:
PDF, 379 KB
english, 2011
Conversion to is in progress
Conversion to is failed