[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Impedance of power distribution networks in TSV-based 3D-ICs
Kiyeong Kim,, Jun So Pak,, Heegon Kim,, Junho Lee,, Kunwoo Park,, Joungho Kim,Year:
2011
Language:
english
DOI:
10.1109/edaps.2011.6213800
File:
PDF, 379 KB
english, 2011