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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Microstructure evolution of electroplated Cu during room temperature transient
Gribelyuk, M.A., Malhotra, S.G., Locke, P.S., DeHaven, P., Fluegel, J., Parks, C., Simon, A.H., Murphy, R.Year:
2000
Language:
english
DOI:
10.1109/iitc.2000.854321
File:
PDF, 273 KB
english, 2000