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[IEEE Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Austin, TX, USA (5-7 March 1996)] Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Reducing PCB solder process defects and improving PCB solder joint reliability through computer simulation
Hark Byeong Park,, Soon Kug Hong,, Rob Tomasek,Year:
1996
Language:
english
DOI:
10.1109/stherm.1996.545101
File:
PDF, 1.64 MB
english, 1996