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[IEEE Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan (2007.01.16-2007.01.18)] Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Stress Monitoring in Epoxy Resins and Embedded Components during Packaging and Curing Processes
Schreier-Alt, Thomas, Badstuebner, Kathrin, Rebholz, Christian, Ansorge, Frank, Reichl, HerbertYear:
2007
Language:
english
DOI:
10.1109/polytr.2007.4339180
File:
PDF, 861 KB
english, 2007