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[IEEE IEEE International Electron Devices Meeting 2003 - Washington, DC, USA (8-10 Dec. 2003)] IEEE International Electron Devices Meeting 2003 - Low-pressure CMP for 300-mm ultra low-k (k=1.6-1.8)/Cu integration
Kondo, S., Yoon, B.U., Tokitoh, S., Misawa, K., Sone, S., Shin, H.J., Ohashi, N., Kobayashi, N.Year:
2003
Language:
english
DOI:
10.1109/iedm.2003.1269187
File:
PDF, 336 KB
english, 2003