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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Metallurgical analysis and hot storage testing of lead-free solder interconnects: SAC versus SACC
Rooney, Daniel T., Geiger, David, Dongkai Shangguan,, Lau, JohnYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4549955
File:
PDF, 2.14 MB
english, 2008