[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - A comprehensive shear-testing facility for joint-scale solder samples
Herkommer, Dominik, Reid, Michael, Punch, JeffYear:
2008
Language:
english
DOI:
10.1109/esime.2008.4525011
File:
PDF, 1.11 MB
english, 2008