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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging
Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, LaiYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756499
File:
PDF, 1.75 MB
english, 2013