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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package
Aibin Yu,, Navas Khan,, Giridhar Archit,, Damaruganath Pinjala,, Kok Chuan Toh,, Vaidyanathan Kripesh,, Seung Wook Yoon,, Lau, John H.Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4549945
File:
PDF, 1.05 MB
english, 2008