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Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling
Che, F. X., Pang, John H. L.Volume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2012.2195007
Date:
March, 2013
File:
PDF, 2.06 MB
english, 2013