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[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Characterization and reliability of conductive ink/polymer filled microvias
Mobley, W.M., Derflinger, T.E., Parker, R.D., Myers, J.D.Year:
1998
Language:
english
DOI:
10.1109/isapm.1998.664442
File:
PDF, 1.11 MB
english, 1998