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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Hermetic wafer-level packaging development for RF MEMS switch
Ferrandon, C., Greco, F., Lagoutte, E., Descours, P., Enyedy, G., Pellat, M., Gillot, C., Rey, P., Mercier, D., Cueff, M., Baillin, X., Perruchot, F., Sillon, N., Liu, L.J., Pacheco, S., Miller, M.Year:
2010
Language:
english
DOI:
10.1109/estc.2010.5642954
File:
PDF, 1.53 MB
english, 2010