[IEEE 2010 3rd Electronic System-Integration Technology...

  • Main
  • [IEEE 2010 3rd Electronic...

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Hermetic wafer-level packaging development for RF MEMS switch

Ferrandon, C., Greco, F., Lagoutte, E., Descours, P., Enyedy, G., Pellat, M., Gillot, C., Rey, P., Mercier, D., Cueff, M., Baillin, X., Perruchot, F., Sillon, N., Liu, L.J., Pacheco, S., Miller, M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2010
Language:
english
DOI:
10.1109/estc.2010.5642954
File:
PDF, 1.53 MB
english, 2010
Conversion to is in progress
Conversion to is failed