[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Power-bandwidth trade-off on TSV array in 3D IC and TSV-RDL junction design challenges
Yao, Wei, Shi, Feng, He, Lei, Pan, Siming, Achkir, Brice, Li, LiYear:
2012
Language:
english
DOI:
10.1109/epeps.2012.6457847
File:
PDF, 912 KB
english, 2012