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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints
Elger, Gordon, Kandaswamy, Shri Vishnu, von Kouwen, Maarten, Derix, Robert, Conti, FoscaYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897486
File:
PDF, 2.68 MB
english, 2014