[IEEE 2014 IEEE 64th Electronic Components and Technology...

  • Main
  • [IEEE 2014 IEEE 64th Electronic...

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

Elger, Gordon, Kandaswamy, Shri Vishnu, von Kouwen, Maarten, Derix, Robert, Conti, Fosca
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897486
File:
PDF, 2.68 MB
english, 2014
Conversion to is in progress
Conversion to is failed