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[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Thermal characterization of TSV based 3D stacked ICs
Swarup, Sahana, Tan, Sheldon X.-D., Liu, ZaoYear:
2012
Language:
english
DOI:
10.1109/epeps.2012.6457910
File:
PDF, 816 KB
english, 2012