[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Application of transmission line models to backpanel plated through-hole via design
Shaowei Deng,, Hubing, T.H., Drewniak, J.L., Jun Fan,, Knighten, J.L., Smith, N.W.Year:
2005
Language:
english
DOI:
10.1109/epep.2005.1563711
File:
PDF, 1.82 MB
english, 2005