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[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Hierarchical and adaptive finite-element reduction-recovery method for large-scale power and signal integrity analysis of high-speed IC and packaging structures
Gan, Houle, Qing He,, Jiao, DanYear:
2008
Language:
english
DOI:
10.1109/epep.2008.4675894
File:
PDF, 717 KB
english, 2008