[IEEE TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference - Denver, CO, USA (2009.06.21-2009.06.25)] TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference - Chip scale packaging of piezoresistive pressure sensors using the dry-film shielding
Chen, Lung-Tai, Hsu, Chung-Yi, Pan, Jason, Chu, C. H., Huang, Tyson, Chu, Peter, Chen, Y. S., Ho, C. W.Year:
2009
Language:
english
DOI:
10.1109/sensor.2009.5285539
File:
PDF, 371 KB
english, 2009