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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Copper-SiOC-AirGap integration in a double level metal interconnect
Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., LYear:
2000
Language:
english
DOI:
10.1109/iitc.2000.854347
File:
PDF, 269 KB
english, 2000