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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Board Level Drop Test and Simulation of CSP for Handheld Application
Jiang, Don-Son, Tzeng, Yuan Lin, Wang, Yu-Po, Hsiao, C.S.Year:
2006
Language:
english
DOI:
10.1109/icept.2006.359845
File:
PDF, 3.91 MB
english, 2006