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[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Integration of High Performance and Low Cost Cu/Ultra Low-k SiOC(k=2.0) Interconnects with Self-formed Barrier Technology for 32nm-node and Beyond

Ohoka, Y., Ohba, Y., Isobayashi, A., Hayashi, T., Komai, N., Arakawa, S., Kanamura, R., Kadomura, S.
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Year:
2007
Language:
english
DOI:
10.1109/iitc.2007.382351
File:
PDF, 532 KB
english, 2007
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