Processing and reliability of CSPs with underfill

IEEE Transactions on Electronics Packaging Manufacturing 2003 / 10 Vol. 26; Iss. 4

Processing and reliability of CSPs with underfill

Liu, J., Johnson, R.W., Yaeger, E., Konarski, M., Crane, L.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2003.822082
Date:
October, 2003
File:
PDF, 1.47 MB
english, 2003
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