[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures
Kohta Nakahira,, Sato, Yuki, Hiroki Kishi,, Ken Suzuki,, Miura, HideoYear:
2010
Language:
english
DOI:
10.1109/esime.2010.5464598
File:
PDF, 9.71 MB
english, 2010