[IEEE 2014 IEEE 64th Electronic Components and Technology...

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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Design of RF and thermal pads of CMOS PAs using copper to copper bonding technology

Hwang, Lih-Tyng, Kuo, An-Yu
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Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897460
File:
PDF, 2.62 MB
english, 2014
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