![](/img/cover-not-exists.png)
[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Design of RF and thermal pads of CMOS PAs using copper to copper bonding technology
Hwang, Lih-Tyng, Kuo, An-YuYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897460
File:
PDF, 2.62 MB
english, 2014