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[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taper pad design to improve electrical performance of BGAs on wafer level package (WLP)
Tsai, Chung-Hao, Yeh, Vincent, Wang, Chuei-Tang, Yu, DougYear:
2012
Language:
english
DOI:
10.1109/edaps.2012.6469383
File:
PDF, 1.08 MB
english, 2012