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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Effect of CMP slurry environments on subcritical crack growth in ultra low-k dielectric materials
Guyer, E.P., Dauskardt, R.H.Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219721
File:
PDF, 174 KB
english, 2003