Thermal analysis of GaAs power monolithic microwave IC's...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1997 / 6 Vol. 20; Iss. 2

Thermal analysis of GaAs power monolithic microwave IC's mounted with epoxy attachment

Nishihori, K., Ishida, K., Kitaura, Y., Uchitomi, N.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.588577
Date:
June, 1997
File:
PDF, 157 KB
english, 1997
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