[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis of halide of epoxy molding compound used for electronic packing
Ye, Jianhai, Bao, Shengxiang, Ma, Lili, Lv, DechunYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270648
File:
PDF, 712 KB
english, 2009