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Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading
Yang, Ping, Liu, Dongjing, Zhao, Yanfang, Tang, Yunqing, Wang, HuanVolume:
62
Language:
english
Journal:
IEEE Transactions on Reliability
DOI:
10.1109/tr.2013.2285038
Date:
December, 2013
File:
PDF, 860 KB
english, 2013