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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - System in wafer-level package technology with RDL-first process
Motohashi, Norikazu, Kimura, Takehiro, Mineo, Kazuyuki, Yamada, Yusuke, Nishiyama, Tomohiro, Shibuya, Koujiro, Kobayashi, Hiroaki, Kurita, Yoichiro, Kawano, MasayaYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898492
File:
PDF, 1.53 MB
english, 2011