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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An improved PCM heat storage technology utilizing metal foam
Dukhan, Nihad, Bodke, SujayYear:
2010
Language:
english
DOI:
10.1109/itherm.2010.5501364
File:
PDF, 637 KB
english, 2010