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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Laser ink-jet solder bump fabrication for electronic interconnection
Fuquan Li,, Chunqing Wang,, Yanhong Tian,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1298784
File:
PDF, 235 KB
english, 2003