[IEEE 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings - Maui, HI, USA (20-23 May 1996)] 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings - A new low temperature diffusion bonding technology between large-area, high-power devices and internal Mo electrodes using Au-Al films

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