Air-gap formation during IMD deposition to lower...

IEEE Electron Device Letters 1998 / 01 Vol. 19; Iss. 1

Air-gap formation during IMD deposition to lower interconnect capacitance

Shieh, B., Saraswat, K.C., McVittie, J.P., List, S., Nag, S., Islamraja, M., Havemann, R.H.
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Volume:
19
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/55.650339
Date:
January, 1998
File:
PDF, 76 KB
english, 1998
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