[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A study of material properties for package flatness in 3D package
Suzuki, Yutaka, Amagai, MasazumiYear:
2008
Language:
english
DOI:
10.1109/vpwj.2008.4762197
File:
PDF, 1.73 MB
english, 2008