[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan -...

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[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A study of material properties for package flatness in 3D package

Suzuki, Yutaka, Amagai, Masazumi
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Year:
2008
Language:
english
DOI:
10.1109/vpwj.2008.4762197
File:
PDF, 1.73 MB
english, 2008
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