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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration
Yoo, B.U., Kondo, S., Tokitoh, S., Namiki, A., Misawa, K., Inukai, K., Ohashi, N., Kobayashi, N.Year:
2004
Language:
english
DOI:
10.1109/iitc.2004.1345761
File:
PDF, 232 KB
english, 2004