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[IEEE 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (8-12 July 2002)] Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) - Test chip for detecting thin film cracking induced by fast temperature cycling and electromigration in multilevel interconnect systems
Nguyen, H.V., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B., Bisschop, J., Mouthaan, A.J., Kuper, F.G.Year:
2002
Language:
english
DOI:
10.1109/ipfa.2002.1025632
File:
PDF, 755 KB
english, 2002