Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging
Locatelli, Marie-Laure, Khazaka, Rabih, Diaham, Sombel, Pham, Cong-Duc, Bechara, Mireille, Dinculescu, Sorin, Bidan, PierreVolume:
29
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/tpel.2013.2279997
Date:
May, 2014
File:
PDF, 1.00 MB
english, 2014