Evaluation of Encapsulation Materials for High-Temperature...

Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging

Locatelli, Marie-Laure, Khazaka, Rabih, Diaham, Sombel, Pham, Cong-Duc, Bechara, Mireille, Dinculescu, Sorin, Bidan, Pierre
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/tpel.2013.2279997
Date:
May, 2014
File:
PDF, 1.00 MB
english, 2014
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