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[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature
Huang, Rui, Robl, Werner, Dehm, Gerhard, Ceric, Hajdin, Detzel, ThomasYear:
2010
Language:
english
DOI:
10.1109/ipfa.2010.5532222
File:
PDF, 2.12 MB
english, 2010