Attenuation in silver-filled conductive epoxy interconnects

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1997 / 3 Vol. 20; Iss. 1

Attenuation in silver-filled conductive epoxy interconnects

Wentworth, S.M., Dillaman, B.L., Chadwick, J.R., Ellis, C.D., Johnson, R.W.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.558544
Date:
March, 1997
File:
PDF, 299 KB
english, 1997
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