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[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Demonstration of a 12 nm-half-pitch copper ultralow-k interconnect process
Chawla, J. S., Chebiam, R., Akolkar, R., Allen, G., Carver, C. T., Clarke, J. S., Gstrein, F., Harmes, M., Indukuri, T., Jezewski, C., Krist, B., Lang, H., Myers, A., Schenker, R., Singh, K. J., TurkoYear:
2013
Language:
english
DOI:
10.1109/iitc.2013.6615593
File:
PDF, 1.01 MB
english, 2013