[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Solder/adhesive bonding using simple planarization technique for 3D integration
Nimura, Masatsugu, Mizuno, Jun, Sakuma, Katsuyuki, Shoji, ShuichiYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898655
File:
PDF, 1.68 MB
english, 2011