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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Correlation of film thickness and deposition temperature with PAI and the scalability of Ti-salicide technology to sub-0.18 μm regime
Ho, C.S., Karunasiri, R.P.G., Chua, S.J., Pey, K.L., Siah, S.Y., Lee, K.H., Chan, L.H.Year:
1998
Language:
english
DOI:
10.1109/iitc.1998.704789
File:
PDF, 387 KB
english, 1998